Intel N450 AU80610004653AA User Manual
Product codes
AU80610004653AA
Introduction
8
Datasheet
1
Introduction
The document provides DC electrical specifications, pinout and signal definitions,
interface functional descriptions, and additional feature information pertinent to the
implementation and operation of the processor on its respective platform.
interface functional descriptions, and additional feature information pertinent to the
implementation and operation of the processor on its respective platform.
Throughout this document, Intel
®
Atom™ Processor N400 Series is referred as the
processor and Intel
®
NM10 Family Express Chipset is referred as the chipset.
The processor is built on 45-nanometer Hi-K process technology. The processor is
designed for a two-chip platform as opposed to the traditional three-chip platforms
(processor, GMCH, and ICH). The two-chip platform consists of a processor and a
chipset which enables better performance, lower cost, easier validation, and improved
x-y footprint. The processor is offered in an BGA559 package.
designed for a two-chip platform as opposed to the traditional three-chip platforms
(processor, GMCH, and ICH). The two-chip platform consists of a processor and a
chipset which enables better performance, lower cost, easier validation, and improved
x-y footprint. The processor is offered in an BGA559 package.
Included in this family of processors is an integrated memory controller (IMC),
integrated graphics processing unit (GPU) and integrated I/O (IIO) (such as DMI) on a
single silicon die. This single die solution is known as a monolithic processor.
integrated graphics processing unit (GPU) and integrated I/O (IIO) (such as DMI) on a
single silicon die. This single die solution is known as a monolithic processor.
1.1
Processor Features
The following list provides some of the key features on this processor:
•
On die, primary 32-kB instructions cache and 24-kB write-back data cache
•
Intel
®
Hyper-Threading Technology (2 threads)
•
On die 512-kB, 8-way L2 cache
•
Support IA 32-bit and Intel
®
64 architecture
•
Intel
®
Streaming SIMD Extensions 2 and 3 (SSE2 and SSE3) and Supplemental
Streaming SIMD Extensions 3 (SSSE3) support
•
Micro-FCBGA8 packaging technologies
•
Thermal management support via Intel
®
Thermal Monitor 1 (TM1) and Intel
®
Thermal Monitor 1 (TM2)
•
Support C-state of C0/C1(E)/C2(E)/C4(E)
•
Enhanced Intel
®
SpeedStep Technology (EIST)
•
Support L2 dynamic cache sizing
•
Execute Disable Bit support for enhanced security