Intel SL2YM User Manual
Pentium
®
II Processor at 350 MHz, 400 MHz, and 450 MHz
42
Datasheet
3.3.3
Settling Limit Guideline
Settling limit defines the maximum amount of ringing at the receiving pin that a signal must reach
before its next transition. The amount allowed is 10% of the total signal swing (V
before its next transition. The amount allowed is 10% of the total signal swing (V
HI –
V
LO
) above and
below its final value. A signal should be within the settling limits of its final value, when either in
its high state or low state, before it transitions again.
its high state or low state, before it transitions again.
Signals that are not within their settling limit before transitioning are at risk of unwanted
oscillations which could jeopardize signal integrity. Simulations to verify settling limit may be
done either with or without the input protection diodes present. Violation of the settling limit
guideline is acceptable if simulations of 5 to 10 successive transitions do not show the amplitude of
the ringing increasing in the subsequent transitions.
oscillations which could jeopardize signal integrity. Simulations to verify settling limit may be
done either with or without the input protection diodes present. Violation of the settling limit
guideline is acceptable if simulations of 5 to 10 successive transitions do not show the amplitude of
the ringing increasing in the subsequent transitions.
4.0
Thermal Specifications and Design Considerations
Initial Pentium II processors take advatange of S.E.C.C. package technology. This technology uses
an extended thermal plate for heatsink attachment. The extended thermal plate interface is intended
to provide accessiblity for multiple types of thermal solutions. Follow-on releases of the Pentium II
processor use S.E.C.C.2 packaging technology. This pakaging technology doesn’t incorporate an
extended thermal plate. Processors which use S.E.C.C.2 packaging technology have either a PLGA
or an OLGA processor core that is surface mounted onto the substrate. All three of these package
variations require unique thermal measuring processes. This chapter provides needed data for
designing a thermal solution. However, for the correct thermal measuring processes please refer to
AP-586, Pentium
an extended thermal plate for heatsink attachment. The extended thermal plate interface is intended
to provide accessiblity for multiple types of thermal solutions. Follow-on releases of the Pentium II
processor use S.E.C.C.2 packaging technology. This pakaging technology doesn’t incorporate an
extended thermal plate. Processors which use S.E.C.C.2 packaging technology have either a PLGA
or an OLGA processor core that is surface mounted onto the substrate. All three of these package
variations require unique thermal measuring processes. This chapter provides needed data for
designing a thermal solution. However, for the correct thermal measuring processes please refer to
AP-586, Pentium
®
II Processor Thermal Design Guidelines (Order Number 243331).
Figure 17
provides a side view of an S.E.C.C. package. This figure provides the thermal plate
location.
Figure 17. Pentium
®
II Processor S.E.C.C. - Side View
Right Latch
Left Latch
Cover
Enhanced Thermal Plate
Extended Thermal Plate