Motorola MC68HC05RC8 User Manual

Motorola

MC68HC05RC16 — Rev. 3.0

General Release Specification

MOTOROLA

Mechanical Specifications

111

General Release Specification — MC68HC05RC16

Section 12. Mechanical Specifications

12.1 Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111

28-Pin Plastic Dual-In-Line Package

(Case 710-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112

28-Pin Small Outline Integrated Circuit Package

(Case 751F-04) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .112

44-Pin Plastic Leaded Chip Carrier Package

(Case 777-02) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113

12.2 Introduction

This section describes the dimensions of the dual-in-line package (DIP),
small outline integrated circuit (SOIC), and plastic leaded chip carrier
(PLCC) MCU packages.

The following figures show the latest packages at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:

•

Local Motorola Sales Office

•

Motorola Mfax

–

Phone 602-244-6609

–

EMAIL rmfax0@email.sps.mot.com

•

Worldwide Web (wwweb) at http://design-net.com

Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.