Motorola MC68HC05RC8 ユーザーズマニュアル
MC68HC05RC16 — Rev. 3.0
General Release Specification
MOTOROLA
Mechanical Specifications
111
General Release Specification — MC68HC05RC16
Section 12. Mechanical Specifications
12.1 Contents
12.2 Introduction
This section describes the dimensions of the dual-in-line package (DIP),
small outline integrated circuit (SOIC), and plastic leaded chip carrier
(PLCC) MCU packages.
small outline integrated circuit (SOIC), and plastic leaded chip carrier
(PLCC) MCU packages.
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest package
specifications, contact one of the following:
publication. To make sure that you have the latest package
specifications, contact one of the following:
•
Local Motorola Sales Office
•
Motorola Mfax
–
Phone 602-244-6609
–
EMAIL rmfax0@email.sps.mot.com
•
Worldwide Web (wwweb) at http://design-net.com
Follow Mfax or wwweb on-line instructions to retrieve the current
mechanical specifications.
mechanical specifications.