Motorola PrPMC800/800ET Processor PMC Module User Manual
PrPMC800/800ET Processor PMC Module Installation and Use (PrPMC800A/IH5)
B Thermal Validation
60
The preferred measurement location for a component may be junction, case, or air as specified
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the component.
Air temperature refers to the ambient temperature near the component.
in the table. Junction temperature refers to the temperature measured by an on-chip thermal
device. Case temperature refers to the temperature at the top, center surface of the component.
Air temperature refers to the ambient temperature near the component.
Table B-1. Thermally Significant Components
Component
Location
Location
General Description
Maximum
Allowable
Temperature
(Degrees C)
Allowable
Temperature
(Degrees C)
Measuremen
t Location
(Junction,
Case or Air)
t Location
(Junction,
Case or Air)
U2
MPC750, 450MHz
MPC7410, 450MHz
MPC7410 (N), 400MHz
MPC7410, 450MHz
MPC7410 (N), 400MHz
104
104
104
104
104
Case
Case
Case
Case
Case
U5
Harrier ASIC
104
Case
U6, U15
Cache SRAM
145
Case
U7-U10, U20-U24
SDRAM
85
Ambient
U1
Clock Chip
85
Ambient
U25, U26
Flash
85
Ambient
U4
Ethernet
85
Case
U3
RS232 Transceiver
85
Ambient
U14
Programmable Logic Device (PLD)
125
Case
U16, U17, U19
SROM
85
Ambient
Q2
2.5V Power Supply
130
Case
Q1
V_PCORE Power Supply
130
Case