Intel E8500 User Manual

Intel

E8500 Chipset North Bridge (NB) and eXternal Memory

Bridge (XMB) Thermal/Mechanical Design Guide

Contents

Introduction......................................................................................................................... 7

1.1

Design Flow .........................................................................................................................7

1.2

Definition of Terms ...............................................................................................................8

1.3

Reference Documents .........................................................................................................9

Packaging Technology ..................................................................................................... 11

2.1

Package Mechanical Requirements ..................................................................................14

Thermal Specifications ..................................................................................................... 15

3.1

Thermal Design Power (TDP) ............................................................................................15

3.2

Die Case Temperature Specifications ...............................................................................15

Thermal Simulation .......................................................................................................... 17

Thermal Metrology ........................................................................................................... 19

5.1

Die Case Temperature Measurements ..............................................................................19

5.2

Power Simulation Software ................................................................................................21

NB Reference Thermal Solution #1.................................................................................. 23

6.1

Operating Environment ......................................................................................................23

6.2

Heatsink Performance .......................................................................................................23

6.3

Mechanical Design Envelope.............................................................................................24

6.4

Board-Level Components Keepout Dimensions ................................................................25

6.5

First NB Heatsink Thermal Solution Assembly ..................................................................26
6.5.1

Heatsink Orientation ............................................................................................27

6.5.2

Extruded Heatsink Profiles ..................................................................................27

6.5.3

Mechanical Interface Material..............................................................................27

6.5.4

Thermal Interface Material...................................................................................27

6.5.5

Heatsink Retaining Fastener ...............................................................................28

6.6

Reliability Guidelines..........................................................................................................29

NB Reference Thermal Solution #2.................................................................................. 31

7.1

Operating Environment ......................................................................................................31

7.2

Heatsink Performance .......................................................................................................31

7.3

Mechanical Design Envelope.............................................................................................32

7.4

Board-Level Components Keepout Dimensions ................................................................33

7.5

Second NB Heatsink Thermal Solution Assembly .............................................................33
7.5.1

Heatsink Orientation ............................................................................................34

7.5.2

Extruded Heatsink Profiles ..................................................................................34

7.5.3

Mechanical Interface Material..............................................................................34

7.5.4

Thermal Interface Material...................................................................................34

7.5.5

Heatsink Retaining Fastener ...............................................................................34

7.6

Reliability Guidelines..........................................................................................................35

XMB Reference Thermal Solution.................................................................................... 37

8.1

Operating Environment ......................................................................................................37

8.2

Heatsink Performance .......................................................................................................37

8.3

Mechanical Design Envelope.............................................................................................38

8.4

Board-Level Components Keepout Dimensions ................................................................38