Fujitsu FR81S User Manual

CHAPTER 1: OVERVIEW

8. Device Package

FUJITSU SEMICONDUCTOR LIMITED

CHAPTER : OVERVIEW

FUJITSU SEMICONDUCTOR CONFIDENTIAL

8. Device Package

This section explains device package of MB91520 series.

Figure 8-1 LQFP-64 (FPT-64P-M24) External Dimensions

64-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

10.0 × 10.0 mm

Lead shape

Gullwing

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.32 g

Code

(Reference)

P-LFQFP64-10×10-0.50

64-pin plastic LQFP

(FPT-64P-M24)

LEAD No.

Details of "A" part

0.25(.010)

(Stand off)

0.10±0.10

0.60±0.15

(.024±.006)

0.50±0.20

(.020±.008)

1.50

+0.20

–0.10
+.008

–.004

.059

0°~8°

"A"

0.08(.003)

0.145±0.055

(.006±.002)

0.08(.003)

(.008±.002)

0.20±0.05

0.50(.020)

12.00±0.20(.472±.008)SQ

INDEX

2005-2010 FUJITSU SEMICONDUCTOR LIMITED F64036S-c-1-3

(Mounting height)

*10.00±0.10(.394±.004)SQ

Dimensions in mm (inches).

Note: The values in parentheses are reference values

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

(.004±.004)

Please confirm the latest Package dimension by following URL.

http://edevice.fujitsu.com/package/en-search/

MB91520 Series

MN705-00010-1v0-E