Motorola MC68VZ328 User Manual
MAPBGA Package Dimensions
Mechanical Data and Ordering Information
20-5
20.5
MAPBGA Package Dimensions
Figure 20-4 illustrates the MAPBGA 13 mm
×
13 mm package, which has 1 mm spacing between the
pads. The device designator for the MAPBGA package is VF.
Figure 20-4. MC68VZ328 MAPBGA Mechanical Drawing
CASE 1242A-03
ISSUE B
4
Z
VIEW M-M
DETAIL K
M
A
DETAIL K
M
0.25 Z X Y
Z
0.1
3
b
144X
e
11X
A1
A2
0.12 Z
5
0.2 Z
ROTATED 90 CLOCKWISE
°
DIM
MIN
MAX
MILLIMETERS
A
---
1.60
A1
0.27
0.47
A2
1.16 REF
b
0.40
0.60
D
13.00 BSC
E
13.00 BSC
e
1.00 BSC
NOTES:
1.
1.
DIMENSIONS ARE IN MILLIMETERS.
2.
INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
PER ASME Y14.5M, 1994.
3.
DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4.
DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5.
PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
12
e
11X
E
D
LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
IDENTIFICATION IN
THIS AREA
X
0.2
Y
METALIZED MARK
FOR PIN 1 IDENTIFICATION
IN THIS AREA
FOR PIN 1 IDENTIFICATION
IN THIS AREA
11
10
9
8
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
S
S
S
0.50 BSC