Intel S5000XAL User Manual
Functional Architecture
Intel
®
Server Board S5000PAL / S5000XAL TPS
Revision
1.4
Intel order number: D31979-007
26
Dual-Core Intel
®
Xeon
®
processors 5000 sequence will encompass the following:
Table 1. Processor Support Matrix
Processor Family
System Bus
Speed
Core
Frequency
Cache
Watts
Support
Intel
®
Xeon
®
processor 533
MHz
All
No
Intel
®
Xeon
®
processor 800
MHz
All
No
Dual-Core Intel
®
Xeon
®
processor 5030
667 MHz
2.67 GHz
2x 2 MB
95
Yes
Dual-Core Intel
®
Xeon
®
processor 5050
667 MHz
3.0 GHz
2x 2 MB
95
Yes
Dual-Core Intel
®
Xeon
®
processor 5060
1066 MHz
3.2 GHz
2x 2 MB
130
Yes
Dual-Core Intel
®
Xeon
®
processor 5063
1066 MHz
3.2 GHz
2x 2 MB
95
Yes
Dual-Core Intel
®
Xeon
®
processor 5080
1066 MHz
3.73 GHz
2x 2 MB
130
Yes
Dual-Core Intel
®
Xeon
®
processor 5110
1066 MHz
1.60 GHz
4MB shared
65
Yes
Dual-Core Intel
®
Xeon
®
processor 5120
1066 MHz
1.87 GHz
4MB shared
65
Yes
Dual-Core Intel
®
Xeon
®
processor 5130
1333 MHz
2 GHz
4MB shared
65
Yes
Dual-Core Intel
®
Xeon
®
processor 5140
1333 MHz
2.33 GHz
4MB shared
65
Yes
Dual-Core Intel
®
Xeon
®
processor 5150
1333 MHz
2.67 GHz
4MB shared
65
Yes
Dual-Core Intel
®
Xeon
®
processor 5160
1333 MHz
3 GHz
4MB shared
80
Yes
3.1.2.1
Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and bus/core speed.
Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than
one stepping back of the other. When only one processor is installed, it must be in the socket labeled
CPU1. The other socket must be empty.
Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than
one stepping back of the other. When only one processor is installed, it must be in the socket labeled
CPU1. The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher current
requirements are not supported.
requirements are not supported.
No terminator is required in the second processor socket when using a single processor configuration.
3.1.2.2
Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heat sink
retention solution. The server board ships with a CEK spring snapped onto the underside of the server
board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor
and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK
spring, server board, TIM, and heat sink.
retention solution. The server board ships with a CEK spring snapped onto the underside of the server
board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor
and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK
spring, server board, TIM, and heat sink.
The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.
Note:
The processor heat sink and CEK spring shown in the following diagram are for reference
purposes only. The actual processor heat sink and CEK solutions compatible with this generation server
board may be of a different design.
board may be of a different design.