Intel E8200 BX80570E8200A User Manual

Thermal and Mechanical Design Guidelines   

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implementing a heatsink attach mechanism that can ensure the system integrity 

under the mechanical shock and vibration profile targets may become prohibitive.  

The recommended maximum heatsink mass for the ATX thermal solution is 550g. This 

mass includes the fan and the heatsink only. The attach mechanism (clip, fasteners, 

etc.) are not included. 

The mass limit for BTX heatsinks that use Intel reference design structural ingredients 

is 900 grams. The BTX structural reference component strategy and design is 

reviewed in depth in the latest version of the Balanced Technology Extended (BTX) 

System Design Guide.  

Note:  The 550g mass limit for ATX solutions is based on the capabilities of the reference 

design components that retain the heatsink to the board and apply the necessary 
preload. Any reuse of the clip and fastener in derivative designs should not exceed 
550g. ATX Designs that have a mass of greater than 550g should analyze the preload 
as discussed in 

Appendix A and retention limits of the fastener. 

Note:  The chipset components on the board are affected by processor heatsink mass. 

Exceeding these limits may require the evaluation of the chipset for shock and 
vibration. 

The package IHS flatness for the product is specified in the datasheet and can be used 

as a baseline to predict heatsink performance during the design phase.  

Intel recommends testing and validating heatsink performance in full mechanical 

enabling configuration to capture any impact of IHS flatness change due to combined 

socket and heatsink loading. While socket loading alone may increase the IHS 

warpage, the heatsink preload redistributes the load on the package and improves the 

resulting IHS flatness in the enabled state. 

Thermal interface material application between the processor IHS and the heatsink 

base is generally required to improve thermal conduction from the IHS to the 

heatsink. Many thermal interface materials can be pre-applied to the heatsink base 

prior to shipment from the heatsink supplier and allow direct heatsink attach, without 

the need for a separate thermal interface material dispense or attach process in the 

final assembly factory. 

All thermal interface materials should be sized and positioned on the heatsink base in 

a way that ensures the entire processor IHS area is covered. It is important to 

compensate for heatsink-to-processor attach positional alignment when selecting the 

proper thermal interface material size. 

When pre-applied material is used, it is recommended to have a protective application 

tape over it. This tape must be removed prior to heatsink installation.