Intel E8200 BX80570E8200A User Manual

Thermal and Mechanical Design Guidelines   

 25 

In addition to passive heatsinks, fan heatsinks and system fans are other solutions 

that exist for cooling integrated circuit devices. For example, ducted blowers, heat 

pipes and liquid cooling are all capable of dissipating additional heat. Due to their 

varying attributes, each of these solutions may be appropriate for a particular system 

implementation.  

To develop a reliable, cost-effective thermal solution, thermal characterization and 

simulation should be carried out at the entire system level, accounting for the thermal 

requirements of each component. In addition, acoustic noise constraints may limit the 

size, number, placement, and types of fans that can be used in a particular design. 

To ease the burden on thermal solutions, the Thermal Monitor feature and associated 

logic have been integrated into the silicon of the processor. By taking advantage of 

the Thermal Monitor feature, system designers may reduce thermal solution cost by 

designing to TDP instead of maximum power. Thermal Monitor attempts to protect the 

processor during sustained workload above TDP. Implementation options and 
recommendations are described in Chapter 

4. 

In summary, considerations in heatsink design include:  

  The local ambient temperature T

A

 at the heatsink, which is a function of chassis 

design. 

  The thermal design power (TDP) of the processor, and the corresponding 

maximum T

C

 as calculated from the thermal profile. These parameters are usually 

combined in a single lump cooling performance parameter, 

CA

 (case to air 

thermal characterization parameter). More information on the definition and the 
use of 

CA

 is given Section 

3.1. 

  Heatsink interface to IHS surface characteristics, including flatness and roughness. 
  The performance of the thermal interface material used between the heatsink and 

the IHS. 

  The required heatsink clip static load, between 18 lbf to 70 lbf throughout the life 

of the product (Refer to Section 

2.1.2.2 for further information). 

  Surface area of the heatsink. 
  Heatsink material and technology. 
  Volume of airflow over the heatsink surface area. 
  Development of airflow entering and within the heatsink area. 
  Physical volumetric constraints placed by the system 

Socket documentation provides Best Known Methods for all aspects LGA775 socket 

based platforms and systems manufacturing. Of particular interest for package and 

heatsink installation and removal is the System Assembly module. A video covering 

system integration is also available. Contact your Intel field sales representative for 

further information. 

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