Intel E8200 BX80570E8200A User Manual
Product codes
BX80570E8200A
Thermal and Mechanical Design Guidelines
7
Figure
7-22. Third Tape Installation ...................................................................94
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7-23. Measuring Resistance between Thermocouple and IHS .......................95
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7-24. Applying Flux to the Thermocouple Bead ..........................................96
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7-25. Cutting Solder ..............................................................................96
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7-26. Positioning Solder on IHS ...............................................................97
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7-27. Solder Station Setup .....................................................................98
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7-28. View Through Lens at Solder Station................................................99
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7-29. Moving Solder back onto Thermocouple Bead ....................................99
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7-30. Removing Excess Solder .............................................................. 100
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7-31. Thermocouple placed into groove .................................................. 101
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7-32. Removing Excess Solder .............................................................. 101
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7-33. Filling Groove with Adhesive ......................................................... 102
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7-34. Application of Accelerant .............................................................. 102
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7-35. Removing Excess Adhesive from IHS ............................................. 103
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7-36. Finished Thermocouple Installation ................................................ 103
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7-37. Thermocouple Wire Management................................................... 104
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7-38. System Airflow Illustration with System Monitor Point Area Identified . 106
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7-39. Thermal sensor Location Illustration .............................................. 107
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7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 .............................. 112
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7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 .............................. 113
Figure
7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 .............................. 114
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7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 ........................ 115
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7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 ........................ 116
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7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 ........................ 117
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7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 ........................ 118
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7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 ........................ 119
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7-48. ATX Reference Clip – Sheet 1........................................................ 120
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7-49. ATX Reference Clip - Sheet 2 ........................................................ 121
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7-50. Reference Fastener - Sheet 1........................................................ 122
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7-51. Reference Fastener - Sheet 2........................................................ 123
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7-52. Reference Fastener - Sheet 3........................................................ 124
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7-53. Reference Fastener - Sheet 4........................................................ 125
Figure 7-54. Intel
®
E18764-001 Reference Solution Assembly ............................. 126