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Intel
E8200
User Manual
Intel E8200 BX80570E8200A User Manual
Product codes
BX80570E8200A
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Thermal and Mechanical Design Guidelines
5
7.2
Board and System Implementation of Intel
®
QST......................................68
7.3
Intel
®
QST Configuration & Tuning..........................................................70
7.4
Fan Hub Thermistor and Intel
®
QST ........................................................70
Appendix A
LGA775 Socket Heatsink Loading ......................................................................71
A.1
LGA775 Socket Heatsink Considerations ..................................................71
A.2
Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel
®
Reference Design .................................................................71
A.3
Heatsink Preload Requirement Limitations................................................71
A.3.1
Motherboard Deflection Metric Definition.....................................72
A.3.2
Board Deflection Limits ............................................................73
A.3.3
Board Deflection Metric Implementation Example.........................74
A.3.4
Additional Considerations .........................................................75
A.3.4.1
Motherboard Stiffening Considerations .........................76
A.4
Heatsink Selection Guidelines.................................................................76
Appendix B
Heatsink Clip Load Metrology ............................................................................77
B.1
Overview ............................................................................................77
B.2
Test Preparation...................................................................................77
B.2.1
Heatsink Preparation................................................................77
B.2.2
Typical Test Equipment ............................................................80
B.3
Test Procedure Examples.......................................................................80
B.3.1
Time-Zero, Room Temperature Preload Measurement...................81
B.3.2
Preload Degradation under Bake Conditions ................................81
Appendix C
Thermal Interface Management.........................................................................83
C.1
Bond Line Management .........................................................................83
C.2
Interface Material Area..........................................................................83
C.3
Interface Material Performance...............................................................83
Appendix D
Case Temperature Reference Metrology..............................................................85
D.1
Objective and Scope .............................................................................85
D.2
Supporting Test Equipment....................................................................85
D.3
Thermal calibration and controls.............................................................87
D.4
IHS Groove .........................................................................................87
D.5
Thermocouple Attach Procedure .............................................................91
D.5.1
Thermocouple Conditioning and Preparation ................................91
D.5.2
Thermocouple Attachment to the IHS .........................................92
D.5.3
Solder Process ........................................................................97
D.5.4
Cleaning & Completion of Thermocouple Installation................... 100
D.6
Thermocouple Wire Management .......................................................... 104
Appendix E
Balanced Technology Extended (BTX) System Thermal Considerations.................. 105
Appendix F
Fan Performance for Reference Design ............................................................. 109
Appendix G
Mechanical Drawings ..................................................................................... 111
Appendix H
Intel
®
Enabled Reference Solution Information .................................................. 127
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