Intel E3300 AT80571RG0601ML Data Sheet
Product codes
AT80571RG0601ML
Datasheet
5
Figures
Static and Transient Tolerance............................................................... 20
Overshoot Example Waveform ............................................................................. 21
®
Celeron
®
Processor E3x00 Series Top-Side Markings Example .............................. 38
10 Processor Land Coordinates and Quadrants, Top View ................................................... 39
11 land-out Diagram (Top View – Left Side) ..................................................................... 42
12 land-out Diagram (Top View – Right Side) ................................................................... 43
13 Processor Series Thermal Profile ................................................................................ 77
14 Case Temperature (TC) Measurement Location ............................................................ 78
15 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 80
16 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 82
17 Processor Low Power State Machine ........................................................................... 86
18 Mechanical Representation of the Boxed Processor ....................................................... 91
19 Space Requirements for the Boxed Processor (Side View).............................................. 92
20 Space Requirements for the Boxed Processor (Top View)............................................... 92
21 Overall View Space Requirements for the Boxed Processor............................................. 93
22 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 94
23 Baseboard Power Header Placement Relative to Processor Socket ................................... 95
24 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 96
25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 96
26 Boxed Processor Fan Heatsink Set Points..................................................................... 97
11 land-out Diagram (Top View – Left Side) ..................................................................... 42
12 land-out Diagram (Top View – Right Side) ................................................................... 43
13 Processor Series Thermal Profile ................................................................................ 77
14 Case Temperature (TC) Measurement Location ............................................................ 78
15 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 80
16 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 82
17 Processor Low Power State Machine ........................................................................... 86
18 Mechanical Representation of the Boxed Processor ....................................................... 91
19 Space Requirements for the Boxed Processor (Side View).............................................. 92
20 Space Requirements for the Boxed Processor (Top View)............................................... 92
21 Overall View Space Requirements for the Boxed Processor............................................. 93
22 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 94
23 Baseboard Power Header Placement Relative to Processor Socket ................................... 95
24 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 96
25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 96
26 Boxed Processor Fan Heatsink Set Points..................................................................... 97