Intel E3300 AT80571RG0601ML Data Sheet
Product codes
AT80571RG0601ML
6
Datasheet
Tables
Voltage Identification Definition..................................................................................15
Absolute Maximum and Minimum Ratings ....................................................................17
Static and Transient Tolerance ...............................................................19
Overshoot Specifications......................................................................................20
Signal Characteristics................................................................................................23
10 GTL+ Signal Group DC Specifications ..........................................................................24
11 Open Drain and TAP Output Signal Group DC Specifications ...........................................24
12 CMOS Signal Group DC Specifications..........................................................................25
13 PECI DC Electrical Limits ...........................................................................................26
14 GTL+ Bus Voltage Definitions .....................................................................................27
15 Core Frequency to FSB Multiplier Configuration.............................................................28
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................29
17 Front Side Bus Differential BCLK Specifications .............................................................29
18 FSB Differential Clock Specifications (800 MHz FSB) ......................................................30
19 Processor Loading Specifications.................................................................................37
20 Package Handling Guidelines......................................................................................37
21 Processor Materials...................................................................................................38
22 Alphabetical Land Assignments...................................................................................44
23 Numerical Land Assignment .......................................................................................54
24 Signal Description.....................................................................................................64
25 Processor Thermal Specifications ................................................................................76
26 Processor Thermal Profile ..........................................................................................77
27 GetTemp0() Error Codes ...........................................................................................83
28 Power-On Configuration Option Signals .......................................................................85
29 Fan Heatsink Power and Signal Specifications...............................................................94
30 Fan Heatsink Power and Signal Specifications...............................................................98
11 Open Drain and TAP Output Signal Group DC Specifications ...........................................24
12 CMOS Signal Group DC Specifications..........................................................................25
13 PECI DC Electrical Limits ...........................................................................................26
14 GTL+ Bus Voltage Definitions .....................................................................................27
15 Core Frequency to FSB Multiplier Configuration.............................................................28
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................29
17 Front Side Bus Differential BCLK Specifications .............................................................29
18 FSB Differential Clock Specifications (800 MHz FSB) ......................................................30
19 Processor Loading Specifications.................................................................................37
20 Package Handling Guidelines......................................................................................37
21 Processor Materials...................................................................................................38
22 Alphabetical Land Assignments...................................................................................44
23 Numerical Land Assignment .......................................................................................54
24 Signal Description.....................................................................................................64
25 Processor Thermal Specifications ................................................................................76
26 Processor Thermal Profile ..........................................................................................77
27 GetTemp0() Error Codes ...........................................................................................83
28 Power-On Configuration Option Signals .......................................................................85
29 Fan Heatsink Power and Signal Specifications...............................................................94
30 Fan Heatsink Power and Signal Specifications...............................................................98