Intel L5310 HH80563JH0258M Data Sheet

Product codes
HH80563JH0258M
Page of 124
Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
123
Boxed Processor Specifications
8.3.2.1
1U Passive/3U+ Active Combination Heat Sink Solution (1U Rack 
Passive)
In the 1U configuration it is assumed that a chassis duct will be implemented to provide 
a minimum airflow of 15 cfm at 0.38 in. H
2
O (25.5 m
3
/hr at 94.6 Pa) of flow 
impedance. The duct should be carefully designed to minimize the airflow bypass 
around the heatsink. It is assumed that a 40°C TLA is met. This requires a superior 
chassis design to limit the T
RISE
 at or below 5°C with an external ambient temperature 
of 35
°
C. Following these guidelines will allow the designer to meet Quad-Core Intel® 
Xeon® Processor X5300 Series Thermal Profile and conform to the thermal 
requirements of the processor.
8.3.2.2
1U Passive/3U+ Active Combination Heat Sink Solution (Pedestal 
Active)
The active configuration of the combination solution is designed to help pedestal 
chassis users to meet the thermal processor requirements without the use of chassis 
ducting. It may be still be necessary to implement some form of chassis air guide or air 
duct to meet the T
LA
 temperature of 40
°
C depending on the pedestal chassis layout. 
Also, while the active thermal solution design will mechanically fit into a 2U volumetric, 
it may not provide adequate airflow. This is due to the requirement of additional space 
at the top of the thermal solution to allow sufficient airflow into the heat sink fan. Use 
of the active configuration in a 2U rackmount chassis is not recommended.
It is recommended that the ambient air temperature outside of the chassis be kept at 
or below 35°C. The air passing directly over the processor thermal solution should not 
be preheated by other system components. Meeting the processor’s temperature 
specification is the responsibility of the system integrator.
8.3.2.3
2U Passive Heat Sink Solution (2U+ Rack or Pedestal)
In the 2U+ passive configuration it is assumed that a chassis duct will be implemented 
to provide a minimum airflow of 27 cfm at 0.182 in. H
2
O (45.9 m
3
/hr at 45.3 Pa) of 
flow impedance. The duct should be carefully designed to minimize the airflow bypass 
around the heatsink. The T
LA
 temperature of 40
°
C should be met. This may require the 
use of superior design techniques to keep T
RISE
 at or below 5°C based on an ambient 
external temperature of 35°C.
8.4
Boxed Processor Contents
A direct chassis attach method must be used to avoid problems related to shock and 
vibration, due to the weight of the thermal solution required to cool the processor. The 
board must not bend beyond specification in order to avoid damage. The boxed 
processor contains the components necessary to solve both issues. The boxed 
processor will include the following items:
• Quad-Core Intel® Xeon® Processor 5300 Series
• Unattached heat sink solution
• Four screws, four springs, and four heat sink standoffs (all captive to the heat sink)
• Foam air bypass pad and skirt (included with 1U passive/3U+ active solution)
• Thermal interface material (pre-applied on heat sink)
• Installation and warranty manual
• Intel  Inside  Logo