Intel L5310 HH80563JH0258M Data Sheet

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

3

Introduction............................................................................................................... 11
1.1

Terminology ..................................................................................................... 13

Electrical Specifications ............................................................................................... 17
2.1

Front Side Bus and GTLREF ................................................................................ 17

Power and Ground Lands.................................................................................... 18

Decoupling Guidelines........................................................................................ 18
2.3.1

 

Decoupling...................................................................................... 18

Decoupling ...................................................................................... 18

Front Side Bus AGTL+ Decoupling ............................................................ 19

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 19
2.4.1

Voltage Identification (VID) ................................................................................ 21

Reserved, Unused, or Test Signals....................................................................... 23

Front Side Bus Signal Groups.............................................................................. 24

CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 26

Test Access Port (TAP) Connection....................................................................... 26

2.11 Mixing Processors.............................................................................................. 27
2.12 Absolute Maximum and Minimum Ratings ............................................................. 28
2.13 Processor DC Specifications ................................................................................ 29

2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 29
2.13.2 VCC Overshoot Specification .................................................................... 42
2.13.3 Die Voltage Validation ............................................................................. 43

2.14 AGTL+ FSB Specifications................................................................................... 43

Mechanical Specifications............................................................................................. 47
3.1

Signal Definitions ....................................................................................................... 79
5.1

Thermal Specifications ................................................................................................ 87
6.1

Package Thermal Specifications........................................................................... 87
6.1.1

Thermal Specifications ............................................................................ 87

Thermal Metrology ................................................................................. 97