Intel Xeon 7130N LF80550KF0878M Data Sheet

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The Dual-Core Intel Xeon processor 7000 series is packaged in a FC-mPGA4 package that 
interfaces with the motherboard via a mPGA604 socket. The package consists of a processor core 
mounted on a substrate pin-carrier. An IHS is attached to the package substrate and core and serves 
as the mating surface for processor component thermal solutions, such as a heatsink. 

 

shows a sketch of the processor package components and how they are assembled together. Refer 
to the mPGA604 Socket Design Guidelines for complete details on the mPGA604 socket.

The package components shown in 

 include the following:

1. IHS

2. Processor die

3. FC-mPGA4 package

4. Pin-side capacitors

5. Package pin

 is not to scale and is for reference only. The mPGA604 socket is not shown.

The package mechanical drawings are shown in 

. The drawings include 

dimensions necessary to design a thermal solution for the processor. These dimensions include:

1. Package reference with tolerances (total height, length, width, etc.)

2. IHS parallelism and tilt

3. Pin dimensions

4. Top-side and back-side component keepout dimensions

5. Reference datums

All drawing dimension are in mm [in].