Intel L5238 EU80573JJ0676M Data Sheet
Product codes
EU80573JJ0676M
Thermal Specifications
78
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in
2.
Thermal Design Power (TDP) should be used for the processor thermal solution design targets. TDP is not
the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based on silicon characterization.
4.
Power specifications are defined at all VIDs found in
. The Dual-Core Intel® Xeon® Processor
X5200 Series may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 6-2.
Dual-Core Intel® Xeon® Processor E5200 Series Thermal Profile Table
Power (W)
T
CASE_MAX
(°C)
0
43.0
5
44.8
10
46.5
15
48.3
20
50.1
25
51.9
30
53.6
35
55.4
40
57.2
45
58.9
50
60.7
55
62.5
60
64.2
65
66.0
Table 6-3.
Dual-Core Intel® Xeon® Processor X5200 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
80
5
See
1, 2, 3, 4, 5