Intel L5238 EU80573JJ0676M Data Sheet

Product codes
EU80573JJ0676M
Page of 114
79
Thermal Specifications
Notes:
1.
The Dual-Core Intel® Xeon® Processor X5200 Series Thermal Profile is representative of a volumetrically 
constrained platform. Please refer to 
 and 
 for discrete points that constitute the thermal 
profile.
2.
Implementation of the Dual-Core Intel® Xeon® Processor X5200 Series Thermal Profile should result in 
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor 
Thermal Profile will result in increased probability of TCC activation and may incur measurable performance 
loss. (See 
 for details on TCC activation).
3.
Refer to the Dual-Core Intel® Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines 
(TMDG) for system and environmental implementation details.
Figure 6-2. Dual-Core Intel® Xeon® Processor X5200 Series Thermal Profiles A and B
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
Power [W]
Tc
a
s
e
 [
C
]
Thermal Profile A (2U)
Y = 0.235*x +42.2
Thermal Profile B (1U)
Y = 0.289*x +42.9
TCASE_MAX is a thermal solution design point. In actuality, units will 
not significantly exceed TCASE_MAX_A due to TCC activation.
40
45
50
55
60
65
70
0
10
20
30
40
50
60
70
80
Power [W]
Tc
a
s
e
 [
C
]
Thermal Profile A (2U)
Y = 0.235*x +42.2
Thermal Profile B (1U)
Y = 0.289*x +42.9
TCASE_MAX is a thermal solution design point. In actuality, units will 
not significantly exceed TCASE_MAX_A due to TCC activation.
Table 6-4.
Dual-Core Intel® Xeon® Processor X5200 Series Thermal A Profile Table 
(Sheet 1 of 2)
Power (W)
T
CASE_MAX
 (°C)
0
42.2
5
43.4
10
44.6
15
45.7
20
46.9
25
48.1
30
49.3
35
50.4
40
51.6
45
52.3