Intel E8190 EU80570PJ0676MN User Manual

Intel

Product codes

EU80570PJ0676MN

Thermal and Mechanical Design Guidelines

3

Contents

Introduction ..................................................................................................... 11

Document Goals and Scope ..................................................................... 11

Importance of Thermal Management ........................................... 11

Document Goals ....................................................................... 11

Document Scope ...................................................................... 12

References ............................................................................................ 13

Definition of Terms................................................................................. 13

Processor Thermal/Mechanical Information .......................................................... 15

Mechanical Requirements ........................................................................ 15

Processor Package .................................................................... 15

Heatsink Attach ........................................................................ 17

General Guidelines ..................................................... 17

Heatsink Clip Load Requirement .................................. 17

Additional Guidelines .................................................. 18

Thermal Requirements ........................................................................... 18

Processor Case Temperature ...................................................... 18

Thermal Profile ......................................................................... 19

Thermal Solution Design Requirements ....................................... 19

................................................................................... 20

Heatsink Design Considerations ............................................................... 21

Heatsink Size ........................................................................... 22

Heatsink Mass .......................................................................... 22

Package IHS Flatness ................................................................ 23

Thermal Interface Material ......................................................... 23

System Thermal Solution Considerations .................................................. 24

Chassis Thermal Design Capabilities ............................................ 24

Improving Chassis Thermal Performance ..................................... 24

Summary ................................................................................ 25

System Integration Considerations ........................................................... 25

Thermal Metrology ............................................................................................ 27

Characterizing Cooling Performance Requirements ..................................... 27

Example .................................................................................. 28

Processor Thermal Solution Performance Assessment ................................. 29

Local Ambient Temperature Measurement Guidelines ................................. 29

Processor Case Temperature Measurement Guidelines ................................ 32

Thermal Management Logic and Thermal Monitor Feature ...................................... 33

Processor Power Dissipation .................................................................... 33

Thermal Monitor Implementation ............................................................. 33

PROCHOT# Signal .................................................................... 34

Thermal Control Circuit ............................................................. 34

Thermal Monitor ........................................................ 34

Thermal Monitor 2 .................................................................... 35

Operation and Configuration ...................................................... 36

On-Demand Mode ..................................................................... 37