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Thermal and Mechanical Design Guidelines
3
Contents
1
Introduction ..................................................................................................... 11
1.1
Document Goals and Scope ..................................................................... 11
1.1.1
Importance of Thermal Management ........................................... 11
1.1.2
Document Goals ....................................................................... 11
1.1.3
Document Scope ...................................................................... 12
1.2
References ............................................................................................ 13
1.3
Definition of Terms................................................................................. 13
2
Processor Thermal/Mechanical Information .......................................................... 15
2.1
Mechanical Requirements ........................................................................ 15
2.1.1
Processor Package .................................................................... 15
2.1.2
Heatsink Attach ........................................................................ 17
2.1.2.1
General Guidelines ..................................................... 17
2.1.2.2
Heatsink Clip Load Requirement .................................. 17
2.1.2.3
Additional Guidelines .................................................. 18
2.2
Thermal Requirements ........................................................................... 18
2.2.1
Processor Case Temperature ...................................................... 18
2.2.2
Thermal Profile ......................................................................... 19
2.2.3
Thermal Solution Design Requirements ....................................... 19
2.2.4
T
CONTROL
................................................................................... 20
2.3
Heatsink Design Considerations ............................................................... 21
2.3.1
Heatsink Size ........................................................................... 22
2.3.2
Heatsink Mass .......................................................................... 22
2.3.3
Package IHS Flatness ................................................................ 23
2.3.4
Thermal Interface Material ......................................................... 23
2.4
System Thermal Solution Considerations .................................................. 24
2.4.1
Chassis Thermal Design Capabilities ............................................ 24
2.4.2
Improving Chassis Thermal Performance ..................................... 24
2.4.3
Summary ................................................................................ 25
2.5
System Integration Considerations ........................................................... 25
3
Thermal Metrology ............................................................................................ 27
3.1
Characterizing Cooling Performance Requirements ..................................... 27
3.1.1
Example .................................................................................. 28
3.2
Processor Thermal Solution Performance Assessment ................................. 29
3.3
Local Ambient Temperature Measurement Guidelines ................................. 29
3.4
Processor Case Temperature Measurement Guidelines ................................ 32
4
Thermal Management Logic and Thermal Monitor Feature ...................................... 33
4.1
Processor Power Dissipation .................................................................... 33
4.2
Thermal Monitor Implementation ............................................................. 33
4.2.1
PROCHOT# Signal .................................................................... 34
4.2.2
Thermal Control Circuit ............................................................. 34
4.2.2.1
Thermal Monitor ........................................................ 34
4.2.3
Thermal Monitor 2 .................................................................... 35
4.2.4
Operation and Configuration ...................................................... 36
4.2.5
On-Demand Mode ..................................................................... 37
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