Intel Core™2 Extreme Processor QX6800 (8M Cache, 2.93 GHz, 1066 MHz FSB) HH80562XH0778M Data Sheet

Product codes
HH80562XH0778M
Page of 88
Introduction
10
Datasheet
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
• Intel
®
 Core™2 Extreme quad-core processor QX6800 — Quad core processor 
in the FC-LGA6 package with a 2x4 MB L2 cache.
• Processor — For this document, the term processor is the generic form of the 
Intel
®
 Core™2 Extreme quad-core processor QX6800. The processor is a single 
package that contains one or more execution units.
• Keep-out zone — The area on or near the processor that system design can not 
utilize. 
• Processor core — Processor core die with integrated L2 cache. 
• LGA775 socket — The processor mates with the system board through a surface 
mount, 775-land, LGA socket.
• Integrated heat spreader (IHS) —A component of the processor package used 
to enhance the thermal performance of the package. Component thermal solutions 
interface with the processor at the IHS surface.
• Retention mechanism (RM) — Since the LGA775 socket does not include any 
mechanical features for heatsink attach, a retention mechanism is required. 
Component thermal solutions should attach to the processor via a retention 
mechanism that is independent of the socket.
• FSB (Front Side Bus) — The electrical interface that connects the processor to 
the chipset. Also referred to as the processor system bus or the system bus. All 
memory and I/O transactions as well as interrupt messages pass between the 
processor and chipset over the FSB.
• Storage conditions — Refers to a non-operational state. The processor may be 
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or 
exposed to free air. Under these conditions, processor lands should not be 
connected to any supply voltages, have any I/Os biased, or receive any clocks. 
Upon exposure to “free air”(i.e., unsealed packaging or a device removed from 
packaging material) the processor must be handled in accordance with moisture 
sensitivity labeling (MSL) as indicated on the packaging material.
• Functional operation — Refers to normal operating conditions in which all 
processor specifications, including DC, AC, system bus, signal quality, mechanical 
and thermal are satisfied. 
• Execute Disable Bit — The Execute Disable bit allows memory to be marked as 
executable or non-executable, when combined with a supporting operating system. 
If code attempts to run in non-executable memory the processor raises an error to 
the operating system. This feature can prevent some classes of viruses or worms 
that exploit buffer over run vulnerabilities and can thus help improve the overall 
security of the system. See the Intel
®
 Architecture Software Developer's Manual 
for more detailed information.
• Intel
®
 64 — An enhancement to Intel's IA-32 architecture, allowing the processor 
to execute operating systems and applications written to take advantage of the 
Intel 64. Further details on Intel 64 and programming model can be found in the 
Intel Extended Memory 64 Technology Software Developer Guide at http://
developer.intel.com/technology/64bitextensions/.
• Enhanced Intel Technology SpeedStep
®
 Technology — Enhanced Intel 
Technology SpeedStep
®
 Technology allows trade-offs to be made between 
performance and power consumptions, based on processor utilization. This may 
lower average power consumption (in conjunction with OS support).
• Intel
®
 Virtualization Technology (Intel
® 
VT) — Intel Virtualization Technology 
provides silicon-based functionality that works together with compatible Virtual 
Machine Monitor (VMM) software to improve upon software-only solutions. Because