Intel 2 Duo U7500 LE80537UE0042M User Manual

Datasheet

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activating the TCC, the VR can cool down as a result of reduced processor power 

consumption. Bi-directional PROCHOT# can allow VR thermal designs to target 

maximum sustained current instead of maximum current. Systems should still provide 

proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in 

case of system cooling failure. The system thermal design should allow the power 

delivery circuitry to operate within its temperature specification even while the 

processor is operating at its TDP. With a properly designed and characterized thermal 

solution, it is anticipated that bi-directional PROCHOT# would only be asserted for very 

short periods of time when running the most power intensive applications. An under-

designed thermal solution that is not able to prevent excessive assertion of PROCHOT# 

in the anticipated ambient environment may cause a noticeable performance loss.