Intel LF80550KF0604M Data Sheet
Mechanical Specifications
46
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
3.4
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
handling loads may be experienced during heatsink removal.
Notes:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5.
Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The Dual-Core Intel Xeon processor 7100 series can be inserted into and removed from
a mPGA604 socket 15 times. The socket should meet the mPGA604 requirements
detailed in the mPGA604 Socket Design Guidelines.
a mPGA604 socket 15 times. The socket should meet the mPGA604 requirements
detailed in the mPGA604 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the Dual-Core Intel Xeon processor 7100 series is 34 g [1.20 oz].
This mass [weight] includes all the components that are included in the package.
This mass [weight] includes all the components that are included in the package.
3.7
Processor Materials
lists some of the package components and associated materials.
3.8
Processor Markings
on the processor. These diagrams are to aid in the identification of the Dual-Core Intel
Xeon processor 7100 series.
Xeon processor 7100 series.
Table 3-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N [80 lbf]
1, 4, 5
Tensile
156 N [35 lbf]
2, 4, 5
Torque
8 N-m [70 lbf-in]
3, 4, 5
Table 3-3.
Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel Plated Copper
Substrate
Fiber-Reinforced Resin
Substrate Pins
Gold Plated Copper