Intel LF80550KF0604M Data Sheet
Dual-Core Intel® Xeon® Processor 7100 Series Datasheet
73
Thermal Specifications
6
Thermal Specifications
6.1
Package Thermal Specifications
The Dual-Core Intel Xeon processor 7100 series requires a thermal solution to maintain
temperatures within operating limits. Any attempt to operate the processor outside
these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
temperatures within operating limits. Any attempt to operate the processor outside
these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor Integrated Heat Spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the
Dual-Core Intel® Xeon® Processor 7100 Series Thermal/Mechanical Design Guidelines.
Dual-Core Intel® Xeon® Processor 7100 Series Thermal/Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to
for
details on the boxed processor.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (T
systems, the processor must remain within the minimum and maximum case
temperature (T
CASE
) specifications as defined by the applicable thermal profile (see
). Thermal solutions not designed to provide this
level of thermal capability may affect the long-term reliability of the processor and
system. For more details on thermal solution design, please refer to the appropriate
processor thermal/mechanical design guidelines.
system. For more details on thermal solution design, please refer to the appropriate
processor thermal/mechanical design guidelines.
The Dual-Core Intel Xeon processor 7100 series uses a methodology for managing
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and assure processor reliability. Selection of the appropriate fan
speed will be based on the temperature reported by the processor’s Thermal Diode. If
the diode temperature is greater than or equal to Tcontrol (see
processor temperatures which is intended to support acoustic noise reduction through
fan speed control and assure processor reliability. Selection of the appropriate fan
speed will be based on the temperature reported by the processor’s Thermal Diode. If
the diode temperature is greater than or equal to Tcontrol (see
processor case temperature must remain at or below the temperature as specified by
the thermal profile (see
the thermal profile (see
). If the diode temperature is less than
Tcontrol, then the case temperature is permitted to exceed the thermal profile, but the
diode temperature must remain at or below Tcontrol. Systems that implement fan
speed control must be designed to take these conditions into account. Systems that do
not alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
diode temperature must remain at or below Tcontrol. Systems that implement fan
speed control must be designed to take these conditions into account. Systems that do
not alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
The Dual-Core Intel Xeon processor 7100 series thermal profile ensures adherence to
Intel reliability requirements. The thermal profile is representative of a industry
enabled 2U heat sink. In this scenario, it is expected that the Thermal Control Circuit
(TCC) would only be activated for very brief periods of time when running the most
power intensive applications. Refer to the Dual-Core Intel® Xeon® Processor 7100
Series Thermal/Mechanical Design Guidelines for details on system thermal solution
design, thermal profiles, and environmental considerations.
Intel reliability requirements. The thermal profile is representative of a industry
enabled 2U heat sink. In this scenario, it is expected that the Thermal Control Circuit
(TCC) would only be activated for very brief periods of time when running the most
power intensive applications. Refer to the Dual-Core Intel® Xeon® Processor 7100
Series Thermal/Mechanical Design Guidelines for details on system thermal solution
design, thermal profiles, and environmental considerations.