Intel AT80604004881AA User Manual
Intel® Xeon® Processor 7500 Datasheet, Volume 1
59
Processor Package Mechanical Specifications
3
Processor Package Mechanical
Specifications
3.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA8) package that
interfaces with the motherboard via an LGA1567 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
interfaces with the motherboard via an LGA1567 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink.
shows a sketch
of the processor package components and how they are assembled together.
Note:
Processor package mechanical information and drawings provided in this section are
preliminary and subject to change.
The package components shown in
1. Integrated Heat Spreader (IHS)
2. Processor core (die)
3. Package substrate
4. Capacitors
2. Processor core (die)
3. Package substrate
4. Capacitors
Note:
1.
Socket and motherboard are included for reference and are not part of processor package.
Figure 3-1. Processor Package Assembly Sketch
Socket
System Board
Capacitors
IHS
Substrate
IHS
Substrate
Die
Socket
System Board
Capacitors
IHS
Substrate
IHS
Substrate
Die