AMD sempron 10 User Manual

Page of 102
Chapter 6
333 FSB AMD Sempron™ Processor Model 10 with 256K L2 Cache Specifications
21
31994A —1 August  2004
AMD Sempron™ Processor Model 10 with 256K L2 Cache Data Sheet
 
6
333 FSB AMD Sempron™ Processor Model 10 with 
256K L2 Cache Specifications
This chapter describes the electrical specifications that are 
u n i q u e   t o   t h e   a dv a n c e d   3 3 3   f r o n t - s i d e   b u s   ( F S B )  
AMD Sempron™ Processor Model 10 with 256K L2 cache.
6.1
Electrical and Thermal Specifications for the AMD Sempron™ 
Processor Model 10 with 256K L2 Cache
Table 1 shows the electrical and thermal specifications in the 
C0 working state and the S1 Stop Grant state for this processor.
Table 1.
Electrical and Thermal Specifications for the AMD Sempron™ Processor Model 10 with 256K 
L2 Cache 
Frequency in MHz
(Model Number)
V
CC_CORE
 
(Core
Voltage)
I
CC
 (Processor Current)
Thermal Power
5
Maximum Die
Temperature
Working State C0
Stop Grant S1
1, 2, 3, 4
Maximum Typical
Maximum
Typical Maximum Typical
1500 (2200+)
1.60 V
38.75 A
30.9 A
8.10 A
4.94 A
62.0 W
49.4 W
90°C
2000 (2800+)
Notes:
2. The maximum Stop Grant currents are absolute worst case currents for parts that may yield from the worst case corner of the 
process and are not representative of the typical Stop Grant current that is currently about one-third of the maximum specified 
current.
3. These currents occur when the AMD Athlon™ system bus is disconnected and has a low power ratio of 1/8 for Stop Grant 
disconnect and a low power ratio of 1/8 Halt disconnect applied to the core clock grid of the processor as dictated by a value of 
2003_1223h programmed into the Clock Control (CLK_Ctl) MSR. For more information, refer to the AMD
 Athlon™ and 
AMD Duron™ Processors BIOS, Software, and Debug Developers Guide, order# 21656.
4. The Stop Grant current consumption is characterized at 50°C and not tested.
5. Thermal design power represents the maximum sustained power dissipated while executing publicly-available software or 
instruction sequences under normal system operation at nominal V
CC_CORE 
. Thermal solutions must monitor the temperature of 
the processor to prevent the processor from exceeding its maximum die temperature.