HP omnibook xe3 Service Manual
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Product Information
HP OmniBook XE3
Specifications
The following tables list the specifications for the notebook and its accessories. These are subject to
change: for the latest versions, see the HP Notebook web site, www.hp.com/notebooks (in Europe:
www.europe.hp.com/notebooks).
change: for the latest versions, see the HP Notebook web site, www.hp.com/notebooks (in Europe:
www.europe.hp.com/notebooks).
Hardware Specifications
Table 1-1. XE3 Series Hardware Specifications
Dimensions
14.1/12.1-in display: 331 × 272.3 × 40.5 mm (13.03 × 10.72 × 1.59 in).
15/13-in display: 331 × 272.3 × 42.0 mm (13.03 × 10.72 × 1.65 in).
15/13-in display: 331 × 272.3 × 42.0 mm (13.03 × 10.72 × 1.65 in).
Weight
3.0–3.4 kg (6.7–.7.4 lb), depending on configuration.
Processor
Intel Pentium III 500/550/600/650/700/750/800 MHz by µPGA2 with SpeedStep.
Intel Celeron 500/550/600/650/700 MHz by µPGA2.
100-MHz FSB.
Intel Celeron 500/550/600/650/700 MHz by µPGA2.
100-MHz FSB.
Display
800 x 600 SVGA TFT 12.1-in LCD.
1024 x 768 XGA TFT 13-in LCD.
1024 x 768 XGA TFT 14.1-in LCD.
1024 x 768 XGA TFT 15-in LCD.
1024 x 768 XGA TFT 13-in LCD.
1024 x 768 XGA TFT 14.1-in LCD.
1024 x 768 XGA TFT 15-in LCD.
Graphics Controller
S3 Savage/IX:
– Integrated 4 MB SGRAM.
– Supports AGP 2x mode.
– 128-bit, single-cycle 3D architecture.
– Simultaneous LCD/CRT and LCD/CRT/TV capability.
– Optimized hardware motion compensation.
– New high-performance, 128-bit 2D engine.
– Integrated single-channel 110-MHz LVDS interface.
– Integrated NTSC/PAL encoder.
– Integrated 4 MB SGRAM.
– Supports AGP 2x mode.
– 128-bit, single-cycle 3D architecture.
– Simultaneous LCD/CRT and LCD/CRT/TV capability.
– Optimized hardware motion compensation.
– New high-performance, 128-bit 2D engine.
– Integrated single-channel 110-MHz LVDS interface.
– Integrated NTSC/PAL encoder.
Chip Set
Intel 440ZXM-100.
SDRAM
100 MHz SDRAM (PC100).
No SDRAM on board.
Two 1.25-in. slots for expansion up to 256 MB, using two 128-MB SODIMM modules
(144 pin, 3.3 V).
No SDRAM on board.
Two 1.25-in. slots for expansion up to 256 MB, using two 128-MB SODIMM modules
(144 pin, 3.3 V).
Power
Battery: rechargeable 9-cell:
– Lithium ion: 11.1 V, 5400 mAh, 18650 size.
– Nickel metal hydride: 10.8 V, 4000 mAh, 17670 size.
– Operating time: up to 3.3 hours typical (varies with configuration and usage).
– Recharge time: 2.2 hours.
– Standby/resume capability.
– Smart pack, SM bus.
AC adapter: Universal 60-watt, 100-240 Vac (50/60 Hz) input, 19 Vdc output.
– Lithium ion: 11.1 V, 5400 mAh, 18650 size.
– Nickel metal hydride: 10.8 V, 4000 mAh, 17670 size.
– Operating time: up to 3.3 hours typical (varies with configuration and usage).
– Recharge time: 2.2 hours.
– Standby/resume capability.
– Smart pack, SM bus.
AC adapter: Universal 60-watt, 100-240 Vac (50/60 Hz) input, 19 Vdc output.
Mass Storage
Hard disk drive:
– 5 or 10 GB, PCI Bus Master Enhanced IDE.
– 9.5 mm, 2.5-in.
– Supports Ultra DMA/33.
Floppy disk drive: 1.44-MB, 12.7 mm, 3-mode module.
CD-ROM/DVD drive: 24x CD-ROM or 4x CD-RW, 12.7 mm module.
– 5 or 10 GB, PCI Bus Master Enhanced IDE.
– 9.5 mm, 2.5-in.
– Supports Ultra DMA/33.
Floppy disk drive: 1.44-MB, 12.7 mm, 3-mode module.
CD-ROM/DVD drive: 24x CD-ROM or 4x CD-RW, 12.7 mm module.