Intel CM8063501287403 User Manual

 

108

Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families 

Datasheet Volume One of Two

The thermal solution is expected to be developed in accordance with the Tcase thermal 

profile. Operational compliance monitoring of thermal specifications and fan speed 

modulation may be done via the DTS based thermal profile. 

Each DTS thermal profile is unique to each TDP and core count combination. These 

T

DTS

 profiles are fully defined by the simple linear equation:

Where:

 is the Processor-to-Ambient thermal resistance of the processor thermal solution.

 is the Local Ambient temperature for the Nominal thermal profile.

 designates the Local Ambient temperature for Short-Term operation.

 is the processor power dissipation.

 provides the PSI

and T

parameters that define T

thermal profile for 

each TDP/Core count combination. 

 illustrates the general form of the 

resulting linear graph resulting from T

.

The slope of a DTS profile assumes full fan speed which is not required over much of 
the power range. Tcontrol is the temperature above which fans must be at maximum 

speed to meet the thermal profile requirements. Tcontrol is different for each SKU and 
may be slightly above or below T

DTS-Max

 of the DTS nominal thermal profile for a 

particular SKU. At many power levels on most embedded SKU’s, temperatures of the 

nominal profile are less than Tcontrol as indicated by the blue shaded region in the DTS 
profile graph of 

. As a further simplification, operation at DTS temperatures