Intel CM8063501287403 User Manual

 

Intel® Xeon® Processor E5-1600 v2/E5-2600 v2 Product Families

21

Datasheet Volume One of Two

Intel® Xeon® processor 

E5-1600 v2 product family

Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel® 

Core™ Processor Family design. It is the next generation processor for use in 

Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families-based 

platforms. Intel® Xeon® processor E5-1600 v2 product family supports 

workstation platforms only.

Intel® Xeon® processor 

E5-2600 v2 product family

Intel’s 22-nm processor design, is the follow-on to the 3rd Generation Intel® 

Core™ Processor Family design. It is the next generation processor for use in 

Intel® Xeon® processor E5-1600 v2/E5-2600 v2 product families-based 

platforms. Intel® Xeon® processor E5-2600 v2 product family supports 

workstation, Efficient Performance server, and HPC platforms.

Integrated Heat Spreader 

(IHS)

A component of the processor package used to enhance the thermal 

performance of the package. Component thermal solutions interface with the 

processor at the IHS surface.

Jitter

Any timing variation of a transition edge or edges from the defined Unit Interval 

(UI).

IOV

I/O Virtualization

LGA2011-0 Socket

The LGA2011-0 land FCLGA12 package mates with the system board through 

this surface mount, LGA2011-0 contact socket.

LLC

Last Level Cache

LRDIMM

Load Reduced Dual In-line Memory Module

NCTF

Non-Critical to Function: NCTF locations are typically redundant ground or non-

critical reserved, so the loss of the solder joint continuity at end of life conditions 

will not affect the overall product functionality.

NEBS

Network Equipment Building System. NEBS is the most common set of 

environmental design guidelines applied to telecommunications equipment in the 

United States.

PCH

Platform Controller Hub. The next generation chipset with centralized platform 

capabilities including the main I/O interfaces along with display connectivity, 

audio features, power management, manageability, security and storage 

features.

PCU

Power Control Unit

PCI Express* 3.0

The third generation PCI Express* specification that operates at twice the speed 

of PCI Express* 2.0 (8 Gb/s); however, PCI Express* 3.0 is completely backward 

compatible with PCI Express* 1.0 and 2.0.

PCI Express 3

PCI Express* Generation 3.0

PCI Express 2

PCI Express* Generation 2.0

PCI Express

PCI Express* Generation 2.0/3.0

PECI

Platform Environment Control Interface

Phit

Physical Unit. An Intel® QPI terminology defining units of transfer at the physical 
layer. 1 Phit is equal to 20 bits in ‘full width mode’ and 10 bits in ‘half width 
mode’

Processor

The 64-bit, single-core or multi-core component (package)

Processor Core

The term “processor core” refers to silicon die itself which can contain multiple 

execution cores. Each execution core has an instruction cache, data cache, and 

256-KB L2 cache. All execution cores share the L3 cache. All DC and signal 

integrity specifications are measured at the processor die (pads), unless 

otherwise noted.

RDIMM

Registered Dual In-line Module

Rank

A unit of DRAM corresponding four to eight devices in parallel, ignoring ECC. 

These devices are usually, but not always, mounted on a single side of a DDR3 

DIMM.

SCI

System Control Interrupt. Used in ACPI protocol.

SSE

Intel® Streaming SIMD Extensions (Intel® SSE)