Intel BXF80646I74770K User Manual

on page 14, access is provided to facilitate manual

installation and removal of the package.

To assist in package orientation and alignment with the socket:
•

The package Pin 1 triangle and the socket Pin 1 chamfer provide visual reference

for proper orientation.

•

The package substrate has orientation notches along two opposing edges of the

package, offset from the centerline. The socket has two corresponding orientation

posts to physically prevent mis-orientation of the package. These orientation

features also provide initial rough alignment of package to socket.

•

The socket has alignment walls at the four corners to provide final alignment of

the package.

LGA1150 Socket

September 2013

Application Guide

Order No.: 328999-002

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