Intel BXF80646I74770K Manual De Usuario
Figure 4.
Pick and Place Cover
Package Installation / Removal
on page 14, access is provided to facilitate manual
installation and removal of the package.
To assist in package orientation and alignment with the socket:
•
•
The package Pin 1 triangle and the socket Pin 1 chamfer provide visual reference
for proper orientation.
•
The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
•
The socket has alignment walls at the four corners to provide final alignment of
the package.
2.4
LGA1150 Socket—LGA1150 Socket
LGA1150 Socket
September 2013
Application Guide
Order No.: 328999-002
13