Intel architecture ia-32 User Manual
Vol. 3A 13-5
POWER AND THERMAL MANAGEMENT
13.4
THERMAL MONITORING AND PROTECTION
The IA-32 architecture provides the following mechanisms for monitoring temperature and
controlling thermal power:
controlling thermal power:
1.
The catastrophic shutdown detector forces processor execution to stop if the processor’s
core temperature rises above a preset limit.
core temperature rises above a preset limit.
2.
Automatic thermal monitoring mechanism forces the processor to reduce it’s power
consumption in order to maintain a predetermined temperature limit.
consumption in order to maintain a predetermined temperature limit.
3.
The software controlled clock modulation mechanism permits operating systems to
implement power management policies that reduce power consumption; this is in addition
to the reduction offered by automatic thermal monitoring mechanisms.
implement power management policies that reduce power consumption; this is in addition
to the reduction offered by automatic thermal monitoring mechanisms.
4.
On-die digital thermal sensor and interrupt mechanisms permit the OS to manage
thermal conditions natively without relying on BIOS or other system board components.
thermal conditions natively without relying on BIOS or other system board components.
The first mechanism is not visible to software. The other three mechanisms are visible to soft-
ware using processor feature information returned by executing CPUID with EAX = 1.
ware using processor feature information returned by executing CPUID with EAX = 1.
The second mechanism, automatic thermal monitoring, provides two modes of operation. One
mode modulates the clock duty cycle; the second mode changes the processor’s frequency. Both
modes are used to control the core temperature of the processor.
mode modulates the clock duty cycle; the second mode changes the processor’s frequency. Both
modes are used to control the core temperature of the processor.
The third mechanism modulates the clock duty cycle of the processor. As shown in Figure 13-2,the phrase ‘duty cycle’ does not refer to the actual duty cycle of the clock signal. Instead it refers
to the time period during which the clock signal is allowed to drive the processor chip. By using
the stop clock mechanism to control how often the processor is clocked, processor power
consumption can be modulated.
to the time period during which the clock signal is allowed to drive the processor chip. By using
the stop clock mechanism to control how often the processor is clocked, processor power
consumption can be modulated.
For previous automatic thermal monitoring mechanisms, software controlled mechanisms that
changed processor operating parameters to impact changes in thermal conditions. Software did
not have native access to the native thermal condition of the processor; nor could software alter
the trigger condition that initiated software program control.
changed processor operating parameters to impact changes in thermal conditions. Software did
not have native access to the native thermal condition of the processor; nor could software alter
the trigger condition that initiated software program control.
The fourth mechanism (listed above) provides access to an on-die digital thermal sensor using
a model-specific register and uses an interrupt mechanism to alert software to initiate digital
thermal monitoring.
a model-specific register and uses an interrupt mechanism to alert software to initiate digital
thermal monitoring.
Figure 13-2. Processor Modulation Through Stop-Clock Mechanism
Clock Applied to Processor
Stop-Clock Duty Cycle
25% Duty Cycle (example only)