Intel X3370 INXEON3370 Data Sheet

Datasheet

33

The processor is packaged in a Flip-Chip Land Grid Array (

FC-LGA8

) package that 

interfaces with the motherboard via an LGA775 socket. The package consists of a 

processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS) 

is attached to the package substrate and core and serves as the mating surface for 

processor component thermal solutions, such as a heatsink. 

 shows a sketch 

of the processor package components and how they are assembled together. Refer to 

the LGA775 Socket Mechanical Design Guide for complete details on the LGA775 

socket.

The package components shown in 

1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors

NOTE:
1.

Socket and motherboard are included for reference and are not part of processor package.