Intel X3370 INXEON3370 Data Sheet
Product codes
INXEON3370
Package Mechanical Specifications
34
Datasheet
3.1.1
Package Mechanical Drawing
. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in].
7. Guidelines on potential IHS flatness variation with socket load plate actuation and
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm [in].
7. Guidelines on potential IHS flatness variation with socket load plate actuation and
installation of the cooling solution is available in the processor Thermal/Mechanical
Design Guidelines.