IBM Intel Xeon E5606 81Y9324 User Manual
Product codes
81Y9324
Thermal Specifications
116
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
The processor Advanced Server/Workstation Platform supports dual thermal profiles,
either of which can be implemented. Both ensure adherence to Intel reliability
requirements. Thermal Profile A is representative of a volumetrically unconstrained
thermal solution (that is, industry enabled 2U heatsink). In this scenario, it is expected
that the Thermal Control Circuit (TCC) would only be activated for very brief periods of
time when running the most power intensive applications. Thermal Profile B is
indicative of a constrained thermal environment (that is, 1U form factor). Because of
the reduced cooling capability represented by this thermal solution, the probability of
TCC activation and performance loss is increased. Additionally, utilization of a thermal
solution that does not meet Thermal Profile B will violate the thermal specifications and
may result in permanent damage to the processor. Refer to the Intel® Xeon®
Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for details on
system thermal solution design, thermal profiles and environmental considerations.
either of which can be implemented. Both ensure adherence to Intel reliability
requirements. Thermal Profile A is representative of a volumetrically unconstrained
thermal solution (that is, industry enabled 2U heatsink). In this scenario, it is expected
that the Thermal Control Circuit (TCC) would only be activated for very brief periods of
time when running the most power intensive applications. Thermal Profile B is
indicative of a constrained thermal environment (that is, 1U form factor). Because of
the reduced cooling capability represented by this thermal solution, the probability of
TCC activation and performance loss is increased. Additionally, utilization of a thermal
solution that does not meet Thermal Profile B will violate the thermal specifications and
may result in permanent damage to the processor. Refer to the Intel® Xeon®
Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for details on
system thermal solution design, thermal profiles and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) and
the associated T
the associated T
CASE
value. It should be noted that the upper point associated with
Thermal Profile B (x = TDP and y = T
CASE_MAX_B
@ TDP) represents a thermal solution
design point. In actuality the processor case temperature will not reach this value due
to TCC activation.
to TCC activation.
Intel recommends that complete thermal solution designs target the Thermal Design
Power (TDP). The Adaptive Thermal Monitor feature is intended to help protect the
processor in the event that an application exceeds the TDP recommendation for a
sustained time period. To ensure maximum flexibility for future requirements, systems
should be designed to the Flexible Motherboard (FMB) guidelines, even if a processor
with lower power dissipation is currently planned. The Adaptive Thermal Monitor
feature must be enabled for the processor to remain within its specifications.
Power (TDP). The Adaptive Thermal Monitor feature is intended to help protect the
processor in the event that an application exceeds the TDP recommendation for a
sustained time period. To ensure maximum flexibility for future requirements, systems
should be designed to the Flexible Motherboard (FMB) guidelines, even if a processor
with lower power dissipation is currently planned. The Adaptive Thermal Monitor
feature must be enabled for the processor to remain within its specifications.
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
Power specifications are defined at all VIDs found in
. The processor may be delivered under
multiple VIDs for each frequency.
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Table 7-1.
Frequency Optimized Server/Workstation Platform Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
130
5
See
1, 2, 3, 4