IBM Intel Xeon E5606 81Y9324 User Manual

Product codes
81Y9324
Page of 186
Intel
®
 Xeon
®
 Processor 5600 Series Datasheet Volume 1
117
Thermal Specifications
Notes:
1.
The Frequency Optimized Server/Workstation Thermal Profile is representative of a volumetrically 
unconstrained platform. Please refer to 
 for discrete points that constitute the thermal profile.
2.
Implementation of the Frequency Optimized Server/Workstation Processor Thermal Profile should result in 
virtually no TCC activation. Furthermore, utilization of thermal solutions that do not meet the thermal 
profile will result in increased probability of TCC activation and may incur measurable performance loss.
3.
Refer to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for system 
and environmental implementation details.
Figure 7-1. Frequency Optimized Server/Workstation Platform Thermal Profile (6 Core)
40
45
50
55
60
65
70
75
80
85
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Power [W]
Te
m
p
e
ra
tur
e
 [
C
]
Y = 0.176 *x + 55.6
40
45
50
55
60
65
70
75
80
85
0
10
20
30
40
50
60
70
80
90
100
110
120
130
Power [W]
Te
m
p
e
ra
tur
e
 [
C
]
Y = 0.176 *x + 55.6
Table 7-2.
Frequency Optimized Server/Workstation Platform Thermal Profile (6 Core)
Power (W)
Maximum T
CASE
 (C)
0
55.6
10
57.4
20
59.1
30
60.9
40
62.7
50
64.4
60
66.2
70
67.9
80
69.7
90
71.5
100
73.2
110
75.0
120
76.8
130
78.5