IBM Intel Xeon E5606 81Y9324 User Manual
Product codes
81Y9324
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
119
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
Power specifications are defined at all VIDs found in
. Processors may be delivered under multiple
VIDs for each frequency.
4.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
) is representative of a volumetrically unconstrained platform. Thermal
) is representative of a volumetrically constrained platform.
2.
Implementation of Thermal Profile A should result in virtually no TCC activation. Utilization of thermal
solutions that do not meet Thermal Profile A will result in increased probability of TCC activation and may
incur measurable performance loss.
3.
Refer to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for system
and environmental implementation details.
Table 7-4.
Advanced Server/Workstation Platform Thermal Specifications
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
95
5
,
1, 2, 3, 4
Figure 7-3. Advanced Server/Workstation Platform Thermal Profile A and B (6 Core)
40
45
50
55
60
65
70
75
80
85
0
5
10
15
2 0
25
30
35
40
45
50
55
60
65
70
75
8 0
85
90
95
Po we r [W]
T
e
m
p
er
at
u
re
[
C
]
Thermal Profile B
Y = 0.257 * x + 56.9
Y = 0.257 * x + 56.9
Thermal Profile A
Y = 0.180 * x + 56.9
Y = 0.180 * x + 56.9
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
40
45
50
55
60
65
70
75
80
85
0
5
10
15
2 0
25
30
35
40
45
50
55
60
65
70
75
8 0
85
90
95
Po we r [W]
T
e
m
p
er
at
u
re
[
C
]
Thermal Profile B
Y = 0.257 * x + 56.9
Y = 0.257 * x + 56.9
Thermal Profile A
Y = 0.180 * x + 56.9
Y = 0.180 * x + 56.9
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.