IBM Intel Xeon E5606 81Y9324 User Manual
Product codes
81Y9324
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
169
Boxed Processor Specifications
9
Boxed Processor Specifications
9.1
Introduction
Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Intel
components available through distribution channels. The Intel
®
Xeon
®
processor 5600
series will be offered as an Intel boxed processor, however the thermal solution will be
sold separately.
sold separately.
Intel Xeon processor 5600 series boxed processors will not include a thermal solution in
the box. Intel will offer boxed thermal solutions separately through the same
distribution channels. Please reference
the box. Intel will offer boxed thermal solutions separately through the same
distribution channels. Please reference
for more details on
Boxed Processor Thermal Solutions.
9.1.1
Available Boxed Thermal Solution Configurations
Intel will offer three different Boxed Heat Sink solutions to support Boxed Processors.
• Boxed Intel Thermal Solution STS100C (Order Code BXSTS100C): A Passive /
Active Combination Heat Sink Solution that is intended for processors with a TDP
up to 130W in a pedestal or 2U+ chassis with appropriate ducting.
up to 130W in a pedestal or 2U+ chassis with appropriate ducting.
• Boxed Intel Thermal Solution STS100A (Order Code BXSTS100A): An Active Heat
Sink Solution that is intended for processors with a TDP of 80W or lower in pedestal
chassis.
chassis.
• Boxed Intel Thermal Solution STS100P (Order Code BXSTS100P): A 25.5 mm Tall
Passive Heat Sink Solution that is intended for processors with a TDP of 95W or
lower in Blades, 1U, or 2U chassis with appropriate ducting.
lower in Blades, 1U, or 2U chassis with appropriate ducting.
9.1.2
Intel
Thermal Solution STS100C
(Passive/Active Combination Heat Sink Solution)
The STS100C, based on a 2U passive heat sink with a removable fan, is intended for
use with processors with TDP’s up to 130W. This heat pipe-based solution is intended to
be used as either a passive heat sink in a 2U or larger chassis, or as an active heat sink
for pedestal chassis.
be used as either a passive heat sink in a 2U or larger chassis, or as an active heat sink
for pedestal chassis.
solution. Although the active combination solution with the removable fan installed
mechanically fits into a 2U keepout, its use has not been validated in that
configuration.
mechanically fits into a 2U keepout, its use has not been validated in that
configuration.
The STS100C in the active fan configuration is primarily designed to be used in a
pedestal chassis where sufficient air inlet space is present. The STS100C with the fan
removed, as with any passive thermal solution, will require the use of chassis ducting
and are targeted for use in rack mount or ducted pedestal servers. The retention
solution used for these products is called Unified Retention System (URS).
pedestal chassis where sufficient air inlet space is present. The STS100C with the fan
removed, as with any passive thermal solution, will require the use of chassis ducting
and are targeted for use in rack mount or ducted pedestal servers. The retention
solution used for these products is called Unified Retention System (URS).