IBM Intel Xeon E5606 81Y9324 User Manual
Product codes
81Y9324
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
171
Boxed Processor Specifications
9.1.4
Intel Thermal Solution STS100P
(Boxed 25.5 mm Tall Passive Heat Sink Solution)
The STS100P is available for use with boxed processors that have TDP’s of 95W and
lower. The 25.5 mm Tall passive solution is designed to be used in SSI Blades, 1U, and
2U chassis where ducting is present. The use of a 25.5 mm Tall heatsink in a 2U chassis
is recommended to achieve a lower heatsink T
lower. The 25.5 mm Tall passive solution is designed to be used in SSI Blades, 1U, and
2U chassis where ducting is present. The use of a 25.5 mm Tall heatsink in a 2U chassis
is recommended to achieve a lower heatsink T
LA
and a more optimized heatsink design.
is a representation of the heat sink solution. The retention solution used for
these products is called Unified Retention System (URS).
9.2
Mechanical Specifications
This section documents the mechanical specifications of the boxed processor solution.
Figure 9-3. STS100A Active Heat Sink
Figure 9-4. STS100P 25.5 mm Tall Passive Heat Sink