IBM Intel Xeon E5606 81Y9324 User Manual
Product codes
81Y9324
Boxed Processor Specifications
174
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
Figure 9-6. Top Side Baseboard Mounting-Hole Keep-Out Zones
1
3
4
5
6
7
8
B
C
D
A
1
2
3
4
5
6
7
8
B
C
D
A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
2X 0.00
0.000
[
]
2X 0.00
0.000[]
2X 7.50
0.295
[
]
9.60
0.378
[
]
12.30
0.484
[
]
67.70
2.665
[
]
2X 72.50
2.854
[
]
32.85
1.293
[
]
47.15
1.856
[
]
BALL 1
4
19.17
0.755
[
]
3.30
0.130
[]
29.90
1.177
[]
BALL 1
4
62.39
2.456
[]
77.90
3.067
[]
30.600
1.205
[]
49.40
1.945
[]
4X
NPTH
THERMAL RETENTION MOUNTING HOLES
4.03
+0.06 -0.03
0.159
+0.002 -0.001
[]
4X
NPTH
SOCKET ILM MOUNTING HOLES
3.80
+0.06 -0.03
0.150
+0.002 -0.001
[]
4X
NO ROUTE
COPPER PAD ON SURFACE
6.00
0.236
[]
4X 6.00
0.236
[]
2X 9.400
0.3701
[]
9.900
0.3898
[]
2X 70.600
2.7795
[]
22.000
0.8661
[
]
58.000
2.2835
[
]
2X 7.50
0.295
[]
2X 72.50
2.854
[]
85.00
3.346
[
]
5.00
0.197
[
]
5.00
0.197
[]
85.00
3.346
[]
2X 80.00
3.150
[
]
3X 80.00
3.150
[]
D77712
2
02
DWG. NO
SHT.
REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
SHEET 2
OF
4
DO NOT SCALE DRAWING
SCALE: 3.000
EASD / PTMI
02
D77712
D
REV
DRAWING NUMBER
SIZE
DEPARTMENT
AS VIEWED FROM PRIMARY SIDE
OF THE MOTHERBOARD
(DETAILS)
SEE DETAIL
A
DETAIL A SCALE 6.000
LEGEND, THIS SHEET ONLY
ZONE 1: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
ZONE 2:
7.0 MM MAX COMPONENT HEIGHT
7
ZONE 3:
3.0 MM MAX COMPONENT HEIGHT
7
ZONE 4: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT RETENTION MODULE OR HEAT SINK TOUCH ZONE
ZONE 5: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, NO ROUTE ZONE
ZONE 6:
1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY
7