IBM Intel Xeon E5606 81Y9324 User Manual
Product codes
81Y9324
Boxed Processor Specifications
172
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
9.2.1
Boxed Processor Heat Sink Dimensions and Baseboard
Keepout Zones
The boxed processor and boxed thermal solutions will be sold separately. Clearance is
required around the thermal solution to ensure unimpeded airflow for proper cooling.
Baseboard keepout zones are shown in
required around the thermal solution to ensure unimpeded airflow for proper cooling.
Baseboard keepout zones are shown in
through
. Physical space
requirements and dimensions for the boxed processor and assembled heat sink are
shown in
shown in
. Mechanical drawings for the 4-pin fan header and
4-pin connector used for the active fan heat sink solution are represented in
None of the heat sink solutions exceed a mass of 550 grams. Note that this is per
processor, a dual processor system will have up to 1100 grams total mass in the heat
sinks.
processor, a dual processor system will have up to 1100 grams total mass in the heat
sinks.
See