IBM Intel Xeon E5606 49Y3776 User Manual

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The processor requires a thermal solution to maintain temperatures within operating 
limits. Any attempt to operate the processor outside these limits may result in 
permanent damage to the processor and potentially other components within the 
system. Maintaining the proper thermal environment is key to reliable, long-term 
system operation.

A complete solution includes both component and system level thermal management 
features. Component level thermal solutions can include active or passive heatsinks 
attached to the processor integrated heat spreader (IHS). Typical system level thermal 
solutions may consist of system fans combined with ducting and venting.

This section provides data necessary for developing a complete thermal solution. For 
more information on designing a component level thermal solution, refer to the Intel® 
Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guidelines.

The boxed processor will ship with a component thermal solution. Refer to 

 for 

details on the boxed processor.

To allow optimal operation and long-term reliability of Intel processor-based systems, 
the processor must remain within the minimum and maximum case temperature 
(T

CASE

) specifications as defined by the applicable thermal profile. Thermal solutions 

not designed to provide sufficient thermal capability may affect the long-term reliability 
of the processor and system. For more details on thermal solution design, please refer 
to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design 
Guidelines.

The processors implement a methodology for managing processor temperatures which 
is intended to support acoustic noise reduction through fan speed control and to assure 
processor reliability. Selection of the appropriate fan speed is based on the relative 
temperature data reported by the processor’s Platform Environment Control Interface 
(PECI) as described in 

. If PECI is less than TCONTROL, then the case 

temperature is permitted to exceed the Thermal Profile, but PECI must remain at or 
below TCONTROL. If PECI >= TCONTROL, then the case temperature must meet the 
Thermal Profile. The temperature reported over PECI is always a negative value and 
represents a delta below the onset of thermal control circuit (TCC) activation, as 
indicated by PROCHOT# (see 

, Processor Thermal Features). Systems that 

implement fan speed control must be designed to use this data. Systems that do not 
alter the fan speed only need to guarantee the case temperature meets the thermal 
profile specifications.

Thermal Profiles are broken out separately for the Intel® Xeon® processor 5600 series 
6-core and 4-core SKUs. This reflects different Thermal Test Vehicle (TTV) Correction 
Factors (CFs), resulting from different power density characteristics associated with the 
different number of cores. There is no difference in platform thermal solution 
assumptions or boundary conditions between the 6-core and 4-core SKUs for a given 
FMB (e.g., 130W). For the latest TTV CFs, please refer to the Intel® Xeon® Processor 
5500/5600 Series Thermal/Mechanical Design Guidelines.