RadioFrame Networks Inc DH2 User Manual

Page of 164
RadioFrame System 
Pre-Installation 
RFN_3.1 Beta
  
49 
3.8.5 Grounding 
• 
No additional grounding is required 
• 
A ground point for chassis ground is provided: #4 screw with internal sems 
washer 
3.8.6 Environment 
• 
Operating Ambient Temperature: 0
o
C to +40
o
C (+32
o
F to +104
o
F) 
• 
Altitude: -200 to +8000 feet above mean sea level; above 8000', reduce 
maximum operating ambient temperature by 2
o
C per 1000' to a maximum of 
13000' 
• 
Storage Temperature: -40
o
C to +70
o
C (-40
o
F to +158
o
F) 
• 
Relative Humidity: 10-90% non condensing 
• 
Shock: 40 g’s 
• 
Vibration:  Level 3 earthquake 
• 
Keep product free from dust, wind, salt, liquids 
3.8.7 Heat 
Load 
• 
Not applicable 
3.9 Interconnecting 
Cabling 
Site planning requires true single point grounding. The Telco entrance and Telco 
termination board should be located as close to the transmission line entry and 
AC service entrance as possible. This enables the individual
 
ground leads to 
bond to a single point, with the least amount of distance between the ground 
leads. 
3.9.1 T1 
T1 lines are used to connect the RadioFrame System with the Mobile Switching 
Center (MSC). Each RFN customer iDEN/802.11b RFS site is typically fed with a 
single T1 line, and subsequently protected with a surge suppressor. The 
suppressor is located between the "smart jack" (maintained by the local 
telephone company) and the Channel Service Unit (CSU). The suppressor 
should be grounded downward directly to the master ground bus (MGB) using a 
#6 AWG green wire. 
The Telco board and the MGB should be mounted adjacent to each other on the 
same wall (the coax ground and power ground should also be at this same