Georgia-Pacific Consumer Products LP 528GP User Manual

 

Note:  The final assemblies using this module would each have an appropriate User 
Manual specific to their features/functions. 
 
Integrated 802.11 b/g/n WLAN Module 

 

IEEE 802.11 b/g/n (single stream n)

 

  Typical WLAN Transmit Power: 

o

  +19.0 dBm, 1 Mbps, CCK (b) 

o

  +15.8 dBm, 54 Mbps, OFDM (g) 

o

  +15.0 dBm, HT20 MCS7 (n) 

  Typical WLAN Sensitivity: 

o

  -90 dBm, 8% PER,11 Mbps (b) 

o

  -73 dBm, 10% PER, 54 Mbps (g) 

o

  -71 dBm, 10% PER, MCS7 (n) 

  Miniature footprint: 10.5mm x 10.5 mm  
  Low height profile: 1.4mm 
  Operating Voltage: 3.13V to 3.46V 
  Operating Temperature: -40 to +85°C 
   Compact design based on Broadcom BCM4390 SoC 

 

Integrated ARM Cortex-M3 apps processor

 

  Wireless Security WEP, WPA Personal, WPA2 Personal 
  Transmit and receive antenna diversity 
  UART serial host interface 
  Simple integration with microcontrollers and microprocessors 

 
 
Bluetooth Smart (BLE) Module 

Features: 
  Built in CC2541 single-chip Bluetooth Smart (BLE 4.0) System-On-Chip (SOC). 
  Memory: 256kB FLASH, 8kB RAM 
  RF Output Power: 0 dBm (Class 3) 
  RF Receive Sensitivity: -94 dBm 
  Size: 11.6mm x 17.9 mm x 2.3 mm 
  Operating Voltage: 2.0V to 3.6V 

  Operating Temperature: -40 to +85

°

C 

  REACH and RoHS compliant 
  Complete power-optimized stack, including Controller and Host 

o GAP – Central, Peripheral, Observer, or Broadcaster (Including Combination Roles) 
o ATT/GATT – Client and Server 
o SMP – AES-128 Encryption and Decryption