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Intel
III Xeon 700 MHz
User Manual
Intel III Xeon 700 MHz 80526KY7001M User Manual
Product codes
80526KY7001M
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TABLE OF CONTENTS
3
5.1.3
STOP-GRANT STATE — STATE 3......................................................................... 42
5.1.4
HALT/GRANT SNOOP STATE — STATE 4 ........................................................... 42
5.1.5
SLEEP STATE — STATE 5..................................................................................... 43
5.1.6
CLOCK CONTROL .................................................................................................. 43
5.2
S
YSTEM
M
ANAGEMENT
B
US
(SMB
US
) I
NTERFACE
........................................................... 43
5.2.1
PROCESSOR INFORMATION ROM....................................................................... 44
5.2.2
SCRATCH EEPROM ............................................................................................... 48
5.2.3
PROCESSOR INFORMATION ROM AND SCRATCH EEPROM SUPPORTED
SMBUS TRANSACTIONS ....................................................................................................... 48
5.2.4
THERMAL SENSOR ................................................................................................ 49
5.2.5
THERMAL SENSOR SUPPORTED SMBUS TRANSACTIONS ............................. 50
5.2.6
THERMAL SENSOR REGISTERS .......................................................................... 51
5.2.7
SMBus Device Addressing....................................................................................... 53
6. THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS......................................... 55
6.1
T
HERMAL
S
PECIFICATIONS
.............................................................................................. 55
6.1.1
POWER DISSIPATION ............................................................................................ 55
6.1.2
PLATE FLATNESS SPECIFICATION...................................................................... 57
6.2
P
ROCESSOR
T
HERMAL
A
NALYSIS
.................................................................................... 57
6.2.1
THERMAL SOLUTION PERFORMANCE ............................................................... 57
6.2.2
THERMAL PLATE TO HEAT SINK INTERFACE MANAGEMENT GUIDE............. 58
6.2.3
MEASUREMENTS FOR THERMAL SPECIFICATIONS......................................... 58
7. MECHANICAL SPECIFICATIONS ........................................................................................... 60
7.1 W
EIGHT
.................................................................................................................................. 64
7.2 C
ARTRIDGE TO
C
ONNECTOR
M
ATING
D
ETAILS
.......................................................................... 64
7.3 S
UBSTRATE
E
DGE
F
INGER
S
IGNAL
L
ISTING
............................................................................. 66
8. INTEGRATION TOOLS............................................................................................................. 76
8.1 I
N
-T
ARGET
P
ROBE
(ITP).......................................................................................................... 76
8.1.1 PRIMARY FUNCTION .................................................................................................... 76
8.1.2 DEBUG PORT CONNECTOR DESCRIPTION .............................................................. 76
8.1.3 KEEP OUT CONCERNS ................................................................................................ 77
8.1.4 ADDITIONAL INTEGRATION TOOL MECHANICAL KEEP OUTS................................ 77
8.1.5 DEBUG PORT SIGNAL DESCRIPTIONS ...................................................................... 77
8.1.6 DEBUG PORT SIGNAL NOTES..................................................................................... 80
8.1.7 Using the TAP to Communicate to the processor........................................................... 82
8.2 L
OGIC
A
NALYZER
I
NTERCONNECT
(LAI)
AND
T
RACE
C
APTURE
T
OOL
C
ONSIDERATIONS
.............. 82
8.2.1 LAI and Trace Capture Tool System Design Considerations ......................................... 82
8.2.2 LAI and Trace Capture tool Mechanical Keep Outs ....................................................... 82
9. BOXED PROCESSOR SPECIFICATIONS............................................................................... 83
9.1 I
NTRODUCTION
........................................................................................................................ 83
9.2 M
ECHANICAL
S
PECIFICATIONS
................................................................................................. 83
9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS ........................................................ 85
9.2.2 BOXED PROCESSOR HEATSINK WEIGHT ................................................................. 85
9.2.3 BOXED PROCESSOR RETENTION MECHANISM ...................................................... 85
9.3 T
HERMAL
S
PECIFICATIONS
....................................................................................................... 86
9.3.1 Boxed Processor Cooling Requirements ........................................................................ 86
9.3.2 Boxed Processor Passive Heatsink Performance .......................................................... 86
9.3.2 Optional auxiliary fan attachment.................................................................................... 87
10. APPENDIX............................................................................................................................... 90
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