Intel III Xeon 700 MHz 80526KY7001M 用户手册

Intel

产品代码

80526KY7001M

TABLE OF CONTENTS

3

STOP-GRANT STATE — STATE 3......................................................................... 42

HALT/GRANT SNOOP STATE — STATE 4 ........................................................... 42

SLEEP STATE — STATE 5..................................................................................... 43

CLOCK CONTROL .................................................................................................. 43

........................................................... 43

PROCESSOR INFORMATION ROM....................................................................... 44

SCRATCH EEPROM ............................................................................................... 48

5.2.3

PROCESSOR INFORMATION ROM AND SCRATCH EEPROM SUPPORTED

SMBUS TRANSACTIONS ....................................................................................................... 48

THERMAL SENSOR ................................................................................................ 49

THERMAL SENSOR SUPPORTED SMBUS TRANSACTIONS ............................. 50

THERMAL SENSOR REGISTERS .......................................................................... 51

SMBus Device Addressing....................................................................................... 53

6. THERMAL SPECIFICATIONS AND DESIGN CONSIDERATIONS......................................... 55

.............................................................................................. 55

POWER DISSIPATION ............................................................................................ 55

PLATE FLATNESS SPECIFICATION...................................................................... 57

.................................................................................... 57

THERMAL SOLUTION PERFORMANCE ............................................................... 57

THERMAL PLATE TO HEAT SINK INTERFACE MANAGEMENT GUIDE............. 58

MEASUREMENTS FOR THERMAL SPECIFICATIONS......................................... 58

7. MECHANICAL SPECIFICATIONS ........................................................................................... 60

.................................................................................................................................. 64

.......................................................................... 64

............................................................................. 66

8. INTEGRATION TOOLS............................................................................................................. 76

(ITP).......................................................................................................... 76

8.1.1 PRIMARY FUNCTION .................................................................................................... 76

8.1.2 DEBUG PORT CONNECTOR DESCRIPTION .............................................................. 76

8.1.3 KEEP OUT CONCERNS ................................................................................................ 77

8.1.4 ADDITIONAL INTEGRATION TOOL MECHANICAL KEEP OUTS................................ 77

8.1.5 DEBUG PORT SIGNAL DESCRIPTIONS ...................................................................... 77

8.1.6 DEBUG PORT SIGNAL NOTES..................................................................................... 80

8.1.7 Using the TAP to Communicate to the processor........................................................... 82

.............. 82

8.2.1 LAI and Trace Capture Tool System Design Considerations ......................................... 82

8.2.2 LAI and Trace Capture tool Mechanical Keep Outs ....................................................... 82

9. BOXED PROCESSOR SPECIFICATIONS............................................................................... 83

........................................................................................................................ 83

................................................................................................. 83

9.2.1 BOXED PROCESSOR HEATSINK DIMENSIONS ........................................................ 85

9.2.2 BOXED PROCESSOR HEATSINK WEIGHT ................................................................. 85

9.2.3 BOXED PROCESSOR RETENTION MECHANISM ...................................................... 85

....................................................................................................... 86

9.3.1 Boxed Processor Cooling Requirements ........................................................................ 86

9.3.2 Boxed Processor Passive Heatsink Performance .......................................................... 86

9.3.2 Optional auxiliary fan attachment.................................................................................... 87

10. APPENDIX............................................................................................................................... 90