Intel 200 MHz FV8050366200 User Manual
Product codes
FV8050366200
PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY
E
46
5/23/97 10:47 AM 24318502.DOC
INTEL CONFIDENTIAL
(until publication date)
Table 19. PPGA Package Dimensions
Millimeters
Inches
Symbol
Min
Max
Notes
Min
Max
Notes
S
1
1.52
2.54
0.060
0.100
5.0.
THERMAL SPECIFICATIONS
The Pentium processor with MMX technology is
specified for proper operation when case
temperature, T
specified for proper operation when case
temperature, T
CASE
, (T
C
) is within the specified range
of 0°C to 70°C.
5.1.
Measuring Thermal Values
To verify that the proper T
C
is maintained, it should
be measured at the center of the package top
surface (opposite of the pins). The measurement is
made in the same way with or without a heatsink
attached. When a heatsink is attached, a hole
(smaller than 0.150" diameter) should be drilled
through the heatsink to allow probing the center of
the package. See Figure 14 for an illustration of how
to measure TC.
surface (opposite of the pins). The measurement is
made in the same way with or without a heatsink
attached. When a heatsink is attached, a hole
(smaller than 0.150" diameter) should be drilled
through the heatsink to allow probing the center of
the package. See Figure 14 for an illustration of how
to measure TC.
To minimize the measurement errors, it is
recommended to use the following approach:
recommended to use the following approach:
•
Use 36-gauge or finer diameter K, T, or J type
thermocouples. The laboratory testing was done
using a thermocouple made by Omega* (part
number 5TC-TTK-36-36).
thermocouples. The laboratory testing was done
using a thermocouple made by Omega* (part
number 5TC-TTK-36-36).
•
Attach the thermocouple bead or junction to the
center of the package top surface using high
thermal conductivity cements. The laboratory
testing was done by using Omega Bond (part
number OB-100).
center of the package top surface using high
thermal conductivity cements. The laboratory
testing was done by using Omega Bond (part
number OB-100).
•
The thermocouple should be attached at a 90-
degree angle as shown in Figure 14.
degree angle as shown in Figure 14.
•
The hole size should be smaller than 0.150' in
diameter.
diameter.
•
Make sure there is no contact between
thermocouple cement and heatsink base. The
contact will affect the thermocouple reading.
thermocouple cement and heatsink base. The
contact will affect the thermocouple reading.
5.1.1.
THERMAL EQUATIONS AND DATA
For the Pentium processor with MMX technology, an
ambient temperature, T
ambient temperature, T
A
(air temperature around the
processor), is not specified directly. The only
restriction is that T
restriction is that T
C
is met. To calculate T
A
values,
the following equations may be used:
T
A
= T
C
– (
P
*
Θ
CA
)
Θ
CA
=
Θ
JA
-
Θ
JC
Where:
T
A
and T
C
=
Ambient and case temperature. (°C)
Θ
CA
=
Case-to-ambient thermal resistance.
(ºC/Watt)
(ºC/Watt)
Θ
JA
=
Junction-to-ambient thermal
resistance. (ºC/Watt)
resistance. (ºC/Watt)
Θ
JC
=
Junction-to-case thermal resistance.
(ºC/Watt)
(ºC/Watt)
P
=
Maximum power consumption (Watt)
Table 20 and Table 21 list the
Θ
JC
and
Θ
CA
values
for the Pentium processor with MMX technology with
passive heatsinks.
passive heatsinks.
Θ
JC
is thermal resistance from die
to package case.
Θ
JC
values shown in these tables
are typical values. The actual
Θ
JC
values depend on
actual thermal conductivity and process of die attach.
Θ
CA
is thermal resistance from package case to the
ambient.
Θ
CA
values shown in these tables are
typical values. The actual
Θ
CA
values depend on the
heatsink design, interface between heatsink and
package, the air flow in the system, and thermal
interactions between processor and surrounding
components through PCB and the ambient. Figure 15
and Figure
package, the air flow in the system, and thermal
interactions between processor and surrounding
components through PCB and the ambient. Figure 15
and Figure
16 show Table
20 and Table
21 in
graphical format.