Intel 200 MHz FV8050366200 User Manual
Product codes
FV8050366200
PENTIUM® PROCESSOR WITH MMX™ TECHNOLOGY
E
48
5/23/97 10:47 AM 24318502.DOC
INTEL CONFIDENTIAL
(until publication date)
Table 20. Thermal Resistance for SPGA Packages
Heatsink Height
θ
JC
θ
CA
(°C/Watt) vs. Laminar Airflow (linear ft/min)
(inches)
(°C/Watt)
0
100
200
400
600
800
0.25
0.9
9.2
8.1
6.7
4.6
3.7
3.1
0.35
0.9
8.9
7.6
6.1
4.1
3.4
2.9
0.45
0.9
8.5
7.1
5.4
3.7
3.0
2.6
0.55
0.9
8.2
6.6
4.8
3.3
2.7
2.4
0.65
0.9
7.8
6.1
4.4
3.1
2.5
2.2
0.80
0.9
7.1
5.4
4.0
2.9
2.3
2.1
1.00
0.9
6.4
4.8
3.7
2.7
2.2
1.9
1.20
0.9
6.0
4.4
3.4
2.5
2.1
1.9
1.40
0.9
5.5
4.0
3.1
2.3
2.0
1.8
Without Heatsink
1.4
14.4
13.4
12.1
9.7
8.0
7.0
NOTES:
Heatsinks are omni directional pin aluminum alloy.
Features were based on standard extrusion practices for a given height:
Pin size ranged from 50 to 129 mils
Pin spacing ranged from 93 to 175 mils
Based thickness ranged from 79 to 200 mils
Heatsink attach was 0.005" of thermal grease.
Attach thickness of 0.002" will improve performance approximately 0.3ºC/Watt.